- PATENTED CERAMIC TECHNOLOGY: Chip on Ceramic, SGLEDS's patented technology replaces the traditional Mcpcb aluminum substrate with a non-conductive ceramic heat sink, and directly solders the LED chip on the ceramic heat sink, effectively reducing the system thermal resistance between the LED PN junction and the surface of the heat sink, resulting in faster heat conduction and higher product reliability, producing an SGLEDS bulb with higher light efficiency.
